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 STT3434
Elektronische Bauelemente 6.1 A, 30 V, RDS(ON) 34 m N-Channel Enhancement Mode Power Mos.FET
RoHS Compliant Product A suffix of "-C" specifies halogen and lead-free
DESCRIPTION
The STT3434 uses advanced trench technology to provide excellent on-resistance and low gate charge. The TSOP-6 package is universally used for all commercial-industrial surface mount applications.
APPLICATIONS
Low on-resistance Capable of 2.5V gate drive
PACKAGE DIMENSIONS
REF. A A1 A2 c D E E1
Millimeter Min. Max.
1.10 Max 0 0.10 0.70 1.00 0.12 Ref 2.70 3.10 2.60 3.00 1.40 1.80
REF. L L1 b e e1
Millimeter Min. Max.
0.45 Ref 0.60 Ref 0 10 0.30 0.50 0.95 Ref 1.90 Ref
ABSOLUTE MAXIMUM RATINGS
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current3 Pulsed Drain Current Power Dissipation Linear Derating Factor Thermal Resistance Junction-ambient3 Max. Operating Junction and Storage Temperature Range
1
Symbol VDS VGS VGS@ 4.5V, ID @TA=25 VGS@ 4.5V, ID @TA=70 IDM PD @TA=25 RJA Tj, Tstg
Ratings 30 12 6.1 4.9 30 1.14 0.01 110 -55 ~ +150
Unit
V V A A W W/ /W
01-June-2005 Rev. A
Page 1 of 4
STT3434
Elektronische Bauelemente 6.1 A, 30 V, RDS(ON) 34 m N-Channel Enhancement Mode Power Mos.FET
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise specified)
Parameter Drain-Source Breakdown Voltage Gate Threshold Voltage Forward Transconductance Gate Leakage Current
Zero Gate Voltage Drain Current (Tj=25) Zero Gate Voltage Drain Current (Tj=75)
Symbol BVDSS VGS(th) gfs IGSS IDSS
Min. 30 0.6 -
Typ. 20 8 1.9 2.6 21 45 40 30
Max. 100 1 5 34 50 12 -
Unit V V S nA uA
Test Conditions VGS = 0, ID = 250uA VDS = VGS, ID = 1mA VDS = 10V, ID = 6.1A VGS = 12 V VDS = 30 V, VGS = 0 V VDS = 24 V, VGS = 0 V VGS = 4.5 V, ID = 6.1 A VGS = 2.5 V, ID = 2.0 A ID = 6.1 A VDS = 15 V VGS = 4.5 V VDS = 15 V ID = 1 A VGS = 4.5 V RG = 6 RL = 15
Drain-Source On-Resistance2 Total Gate Charge
2
RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf
m
Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time
2
nC
ns
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise specified)
Parameter Forward On Voltage2 Reverse Recovery Time
Notes:
2
Symbol VSD Trr
Min. -
Typ. 40
Max. 1.2 -
Unit V ns
Test Conditions IS = 1.7 A, VGS = 0 V IS = 1.7 A, dl/dt = 100A/us
1. Pulse width limited by Max. junction temperature. 2. Pulse width300us, duty cycle 2%. 2 3. Surface mounted on 1 in copper pad of FR4 board, t 5 sec; 180C/W when mounted on Min. copper pad.
01-June-2005 Rev. A
Page 2 of 4
STT3434
Elektronische Bauelemente 6.1 A, 30 V, RDS(ON) 34 m N-Channel Enhancement Mode Power Mos.FET
CHARACTERISTIC CURVES
01-June-2005 Rev. A
Page 3 of 4
STT3434
Elektronische Bauelemente 6.1 A, 30 V, RDS(ON) 34 m N-Channel Enhancement Mode Power Mos.FET
01-June-2005 Rev. A
Page 4 of 4


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